Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5641840 | Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device sealed with the epoxy resin composition | Satoru Tsuchida, Masahiko Osaka, Yasuaki Nakamura | 1997-06-24 |