Issued Patents 1997
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5683075 | Trench isolation stress relief | Donald F. Hemmenway | 1997-11-04 |
| 5682062 | System for interconnecting stacked integrated circuits | — | 1997-10-28 |
| 5668409 | Integrated circuit with edge connections and method | — | 1997-09-16 |
| 5646067 | Method of bonding wafers having vias including conductive material | — | 1997-07-08 |
| 5639688 | Method of making integrated circuit structure with narrow line widths | Jose Avelino Delgado | 1997-06-17 |
| 5618752 | Method of fabrication of surface mountable integrated circuits | — | 1997-04-08 |
| 5608264 | Surface mountable integrated circuit with conductive vias | — | 1997-03-04 |