Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5631806 | Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints | Kuo-Jen Tseng, Hsi Y. Hsiao | 1997-05-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5631806 | Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints | Kuo-Jen Tseng, Hsi Y. Hsiao | 1997-05-20 |