Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703400 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Robert J. Wojnarowski | 1997-12-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703400 | Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers | Robert J. Wojnarowski | 1997-12-30 |