Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5624300 | Apparatus and method for uniformly polishing a wafer | Sadahiro Kishii | 1997-04-29 |
| 5621239 | SOI device having a buried layer of reduced resistivity | Hiroshi Horie, Atsushi Fukuroda | 1997-04-15 |