Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5669545 | Ultrasonic flip chip bonding process and apparatus | C. V. Pham, Brian John Hayden | 1997-09-23 |
| 5655700 | Ultrasonic flip chip bonding process and apparatus | Cuong Pham, Brian John Hayden | 1997-08-12 |
| 5598096 | Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal | Cuong Pham, Brian John Hayden, Peter R. Cibirka | 1997-01-28 |