Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5675183 | Hybrid multichip module and methods of fabricating same | David Lunsford | 1997-10-07 |
| 5625227 | Circuit board-mounted IC package cooling apparatus | Scott Estes | 1997-04-29 |
| 5623594 | Embedded thermistor for on-board thermal monitoring of electrical components | — | 1997-04-22 |
| 5593322 | Leadless high density connector | Victor Key Pecone | 1997-01-14 |