Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5633480 | Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits | Junzaburo Shirai | 1997-05-27 |
| 5629497 | Printed wiring board and method of manufacturing in which a basefilm including conductive circuits is covered by a cured polyimide resin lay | Junzaburo Shirai | 1997-05-13 |