Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668060 | Outer lead for a semiconductor IC package and a method of fabricating the same | Kazuo Kimura | 1997-09-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5668060 | Outer lead for a semiconductor IC package and a method of fabricating the same | Kazuo Kimura | 1997-09-16 |