AI

Akira Isobe

NE Nec: 3 patents #27 of 1,182Top 3%
📍 Chiyoda, JP: #6 of 85 inventorsTop 8%
Overall (1997): #18,377 of 185,788Top 10%
3
Patents 1997

Issued Patents 1997

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
5702291 Wafer polishing method and wafer polishing apparatus 1997-12-30
5677239 Method for fabricating multi-level interconnection structure for semiconductor device 1997-10-14
5616212 Method for polishing a wafer by supplying surfactant to the rear surface of the wafer 1997-04-01