Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5684332 | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom | C. M. Amy Chen, James Chung, K. Lin, Simon Li | 1997-11-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5684332 | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom | C. M. Amy Chen, James Chung, K. Lin, Simon Li | 1997-11-04 |