Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5703402 | Output mapping of die pad bonds in a ball grid array | Hu-Kong Lai | 1997-12-30 |
| 5686699 | Semiconductor board providing high signal pin utilization | Hu-Kong Lai | 1997-11-11 |