Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365106 | Resin mold semiconductor device | — | 1994-11-15 |
| 5331029 | Resin for bonding polyarylene sulfide and adhesive | Hiroyuki Sato, Kazuhiro Watanabe | 1994-07-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365106 | Resin mold semiconductor device | — | 1994-11-15 |
| 5331029 | Resin for bonding polyarylene sulfide and adhesive | Hiroyuki Sato, Kazuhiro Watanabe | 1994-07-19 |