Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5316974 | Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer | — | 1994-05-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5316974 | Integrated circuit copper metallization process using a lift-off seed layer and a thick-plated conductor layer | — | 1994-05-31 |