Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5362680 | Technique for enhancing adhesion capability of heat spreaders in molded packages | Katherine G. Heinen, Brenda C. Gogue | 1994-11-08 |
| 5359224 | Insulated lead frame for integrated circuits and method of manufacture thereof | Katherine G. Heinen | 1994-10-25 |
| 5310520 | Circuit system, a composite material for use therein, and a method of making the material | Sunil Chandra Jha, James A. Forster | 1994-05-10 |
| 5276423 | Circuit units, substrates therefor and method of making | James A. Forster | 1994-01-04 |