Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5275975 | Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material | Daniel Baudouin | 1994-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5275975 | Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material | Daniel Baudouin | 1994-01-04 |