Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367764 | Method of making a multi-layer circuit assembly | Scott G. Ehrenberg, Igor Y. Khandros | 1994-11-29 |
| 5346861 | Semiconductor chip assemblies and methods of making same | Igor Y. Khandros | 1994-09-13 |
| 5347159 | Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate | Igor Y. Khandros | 1994-09-13 |
| 5282312 | Multi-layer circuit construction methods with customization features | Igor Y. Khandros, Gary W. Grube | 1994-02-01 |