Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5364706 | Clad bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Kensei Murakami | 1994-11-15 |
| 5298219 | High purity gold bonding wire for semiconductor device | Katsuyuki Toyofuku, Ichiro Nagamatsu, Shinji Shirakawa, Hiroto Iga, Kensei Murakami | 1994-03-29 |