Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5369220 | Wiring board having laminated wiring patterns | Keizo Harada, Takatoshi Takikawa, Takao Maeda, Shunsuke Ban | 1994-11-29 |
| 5356661 | Heat transfer insulated parts and manufacturing method thereof | Akira Doi, Hiromu Kawai | 1994-10-18 |
| 5353499 | Method of manufacturing a multilayered wiring board | Hisao Hattori, Tomohiko Ihara, Hiroshi Yoshino | 1994-10-11 |
| 5348792 | Multilayered wiring board with wiring configurations to reduce crosstalk | Hisao Hattori, Tomohiko Ihara, Hiroshi Yoshino | 1994-09-20 |