Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5336547 | Electronic components mounting/connecting package and its fabrication method | Tetsuo Kawakita, Takayuki Yoshida | 1994-08-09 |
| 5316204 | Method for bonding lead with electrode of electronic device | Shinitsu Takehashi, Hiroaki Fujimoto | 1994-05-31 |
| 5316610 | Bonding apparatus | Tomohiro Tamaki, Hiroaki Fujimoto, Yoshinobu Takeshita | 1994-05-31 |