Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5314848 | Method for manufacturing a semiconductor device using a heat treatment according to a temperature profile that prevents grain or particle precipitation during reflow | Takatoshi Yasui, Chiaki Kudo, Toyokazu Fujii, Yuka Terai, Shinichi Imai +2 more | 1994-05-24 |