Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5360649 | Thickness-reduced draw-formed can | Ikuo Komatsu, Katsuhiro Imazu, Tomomi Kobayashi | 1994-11-01 |
| 5332921 | Resin-seal type semiconductor device | Noriaki Dousen, Kouji Araki | 1994-07-26 |
| 5317525 | Electric power system simulator | Hisao Taoka, Isao Iyoda, Hideo Noguchi, Yukio KOJIMA, Shigeru Warashina | 1994-05-31 |