Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5289033 | Packaging of semiconductor chips with resin | Yukio Asami, Akira Kojima | 1994-02-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5289033 | Packaging of semiconductor chips with resin | Yukio Asami, Akira Kojima | 1994-02-22 |