Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5340010 | Bonding apparatus | Osamu Nakamura | 1994-08-23 |
| 5323948 | Wire clamper | Nobuto Yamazaki, Koichi Harada, Mitsuaki Sakakura, Takayuki Iiyama | 1994-06-28 |
| 5275324 | Wire bonding apparatus | Nobuto Yamazaki, Mitsuaki Sakakura, Koichi Harada | 1994-01-04 |