Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5335457 | Method of chucking semiconductor wafers | Akira Matsuda, Shigeki Shudo, Noboru Shimamoto, Kohichi Tanaka, Fumio Suzuki | 1994-08-09 |
| 5333413 | Automatic wafer lapping apparatus | — | 1994-08-02 |