Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5304241 | Electronic component sealing filler | Takashi Ueno, Toshiaki Maeda | 1994-04-19 |
| 5298328 | Packing material and method of making same | Hajime Abe, Tsutomu Nishiwaki | 1994-03-29 |