Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5334645 | Substrate for circuit board including the glass fibers as reinforcing material | Seishiro Yamakawa, Shigeru Yamamoto, Jun Naka, Tadashi Kokubo | 1994-08-02 |
| 5284807 | Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material | Seishiro Yamakawa, Shigeru Yamamoto, Jun Naka, Tadashi Kukubo | 1994-02-08 |
| 5275878 | Composite dielectric and printed-circuit use substrate utilizing the same | Seishiro Yamakawa, Michimasa Tsuzaki, Satoshi Fujiki, Akiyoshi Nozue, Kazunobu Abe +1 more | 1994-01-04 |