Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367193 | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die | — | 1994-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367193 | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die | — | 1994-11-22 |