Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5294835 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Kazumasa Igarashi, Hideto Kimura, Megumu Nagasawa, Tsutomu Nishioka, Hideyuki Usui +3 more | 1994-03-15 |