RJ

Randall E. Johnson

WC W.R. Grace & Co.-Conn.: 1 patents #61 of 188Top 35%
TI Texas Instruments: 1 patents #189 of 620Top 35%
📍 White Lake, MI: #2 of 11 inventorsTop 20%
🗺 Michigan: #329 of 4,313 inventorsTop 8%
Overall (1994): #22,530 of 165,921Top 15%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5371998 Modified atmosphere packaging device Stephen Linwood Gray 1994-12-13
5327327 Three dimensional assembly of integrated circuit chips Dean L. Frew, Mark A. Kressley, Arthur M. Wilson, Juanita G. Miller, Philip Hecker +2 more 1994-07-05