Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5296082 | Mold for printed wiring board | — | 1994-03-22 |
| 5277929 | Method for masking through holes in manufacturing process of printed circuit board | Kameharu Seki, Yasuaki Otani | 1994-01-11 |