TK

Teruo Kusaka

NE Nec: 2 patents #60 of 1,007Top 6%
Overall (1994): #18,326 of 165,921Top 15%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5367765 Method of fabricating integrated circuit chip package — 1994-11-29
5297333 Packaging method for flip-chip type semiconductor device — 1994-03-29