Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5368193 | Electronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging means | Tetsuo Takahashi, Shinichi Araya, Kuniaki Takahashi, Kunio Mogi, Takeshi Ito +1 more | 1994-11-29 |
| 5353933 | Package of rolled photosensitive material | Hisashi Takahashi, Shigehisa Shimizu, Satoshi Mino, Hiroyuki Osanai | 1994-10-11 |