Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5302852 | Semiconductor device package having a low profile structure and high strength | Akio Tanda | 1994-04-12 |
| 5284899 | Resin paste for tight sealing | Sueo Morishige, Katsushi Terajima, Toshiro Takeda, Yushi Sakamoto, Takashi Suzuki | 1994-02-08 |