HO

Hiroshi Okumura

Rohm Co.: 2 patents #18 of 173Top 15%
Overall (1994): #31,750 of 165,921Top 20%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5370300 Method and apparatus for wire bonding — 1994-12-06
5294828 Plate for supporting a punched leadframe — 1994-03-15