HI

Hiroshi Ise

NE Nec: 1 patents #206 of 1,007Top 25%
📍 Yokkaichi, JP: #39 of 136 inventorsTop 30%
Overall (1994): #125,996 of 165,921Top 80%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5356283 Metal mold for sealing semiconductor devices with a resin Makoto Hamada 1994-10-18