Issued Patents 1994
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371404 | Thermally conductive integrated circuit package with radio frequency shielding | Anthony B. Suppelsa | 1994-12-06 |
| 5336931 | Anchoring method for flow formed integrated circuit covers | Douglas W. Hendricks | 1994-08-09 |
| 5323947 | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement | Kenneth M. Wasko, Douglas W. Hendricks | 1994-06-28 |
| 5313365 | Encapsulated electronic package | Robert W. Pennisi, Glenn E. Gold, Glenn F. Urbish | 1994-05-17 |
| 5296046 | Subliming solder flux composition | Douglas W. Hendricks | 1994-03-22 |
| 5296738 | Moisture relief for chip carrier | Bruce J. Freyman, Barry M. Miles | 1994-03-22 |