Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5320272 | Tin-bismuth solder connection having improved high temperature properties, and process for forming same | Harry Fuerhaupter, George N. Demet | 1994-06-14 |
| 5316205 | Method for forming gold bump connection using tin-bismuth solder | — | 1994-05-31 |
| 5282565 | Solder bump interconnection formed using spaced solder deposit and consumable path | — | 1994-02-01 |