Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5334872 | Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad | Osamu Nakagawa | 1994-08-02 |
| 5327012 | Semiconductor device having a double-layer interconnection structure | Kohsaku Yano, Teruhito Ohnishi, Hiroshi Nishimura | 1994-07-05 |
| 5309021 | Semiconductor device having particular power distribution interconnection arrangement | Haruo Shimamoto, Jun Shibata, Toru Tachikawa, Hiroshi Seki | 1994-05-03 |
| 5295752 | Printer using double sheets of pressure sensitive paper | Shinsuke Kawamoto, Osamu Miyajima | 1994-03-22 |