Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5288698 | Method of positioning lead frame on molding die to seal semiconductor element with resin | Toshinobu Banjo, Minoru Tanaka | 1994-02-22 |
KS
Kouji Shika
Overall (1994): #102,954 of 165,921Top 65%
1
Patents 1994