Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5373188 | Packaged semiconductor device including multiple semiconductor chips and cross-over lead | Koichi Nakagawa | 1994-12-13 |
| 5334803 | Semiconductor device and method of producing the same | Ken Yamamura, Naoto Ueda, Hitoshi Fujimoto, Kiyoaki Tsumura, Hitoshi Sasaki +1 more | 1994-08-02 |
| 5303120 | Method of manufacturing inversion type IC's and IC module using same | Hiroshi Seki | 1994-04-12 |