Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5288661 | Semiconductor device having bonding pad comprising buffer layer | Shinichi Satoh, Hiroshi Kimura, Wataru Wakamiya, Yoshinori Tanaka | 1994-02-22 |
| 5278437 | Stacked capacitor type semiconductor memory device and manufacturing method thereof | Wataru Wakamiya, Yoshinori Tanaka, Takahisa Eimori, Hiroshi Kimura, Shinichi Satoh | 1994-01-11 |