Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5374893 | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Nicholas G. Koopman, Glenn Rinne, Edward K. Yung | 1994-12-20 |
| 5325265 | High performance integrated circuit chip package | Arnold Reisman, Deepak Nayak, Lih-Tyng Hwang, Giora Dishon, Scott Jacobs +2 more | 1994-06-28 |
| 5289631 | Method for testing, burn-in, and/or programming of integrated circuit chips | Nicholas G. Koopman, Glenn Rinne, Edward K. Yung | 1994-03-01 |