Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5340772 | Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die | — | 1994-08-23 |
| 5341024 | Method of increasing the layout efficiency of dies on a wafer, and increasing the ratio of I/O area to active area per die | — | 1994-08-23 |
| 5329157 | Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area | — | 1994-07-12 |