Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5357672 | Method and system for fabricating IC packages from laminated boards and heat spreader | — | 1994-10-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5357672 | Method and system for fabricating IC packages from laminated boards and heat spreader | — | 1994-10-25 |