Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5341025 | IC package and LSI package using a lead frame formed of a copper-zirconium alloy | Shinzo Sugai | 1994-08-23 |
| 5315152 | Lead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frame | Takashi Kuse | 1994-05-24 |