Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5347363 | External lead shape measurement apparatus for measuring lead shape of semiconductor package by using stereoscopic vision | — | 1994-09-13 |
| 5331397 | Inner lead bonding inspecting method and inspection apparatus therefor | Mitsusada Shibasaka | 1994-07-19 |