Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5352632 | Multichip packaged semiconductor device and method for manufacturing the same | — | 1994-10-04 |
| 5314842 | Resin-sealed type semiconductor device and method for manufacturing the same | Toshio Ishigami | 1994-05-24 |