Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5350712 | Method of manufacturing a semiconductor IC device having multilayer interconnection structure | — | 1994-09-27 |
| 5330934 | Method of fabricating a semiconductor device having miniaturized contact electrode and wiring structure | Naoki Ikeda | 1994-07-19 |