FE

Floyd K. Eide

DM Dense-Pac Microsystems: 1 patents #1 of 1Top 100%
📍 Tecate Mission Road, CA: #23 of 120 inventorsTop 20%
🗺 California: #3,049 of 13,957 inventorsTop 25%
Overall (1994): #136,564 of 165,921Top 85%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5313096 IC chip package having chip attached to and wire bonded within an overlying substrate — 1994-05-17